COPPER PARTICLE FLUID DISPERSION AND METHOD FOR PRODUCING CONDUCTIVE FILM USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a copper particle fluid dispersion excellent in storage stability and enabling a conductive film excellent in conductivity by optical baking, and a method for producing the conductive film using the same.SOLUTION: A conductive film is formed on a substrate by: applying a copper particle fluid dispersion onto a substrate by screen printing or flexographic printing, the copper particle fluid dispersion being obtained by dispersing fine copper particles coated with an azole compound such as benzotriazol and having an average particle size of 1-100 nm and coarse copper particles having an average particle size of 0.3-20 μm in a dispersion medium such as ethylene glycol in such a way that the total amount of the fine copper particles and the coarse copper particles is 50-90 mass% and a mass ratio of them is 1:9-5:5; prebaking the applied copper particle fluid dispersion by vacuum drying; and optically baking the prebaked copper particle fluid dispersion by irradiating the prebaked copper particle fluid dispersion with light having a wavelength of 200-800 nm at a pulse period of 100-3000 μs and a pulse voltage of 1600-3600 V.