发明名称 |
COMPLEMENTARY SONOS INTEGRATION INTO CMOS FLOW |
摘要 |
Methods of integrating complementary SONOS devices into a CMOS process flow are described. In one embodiment, the method begins with depositing a hardmask (HM) over a substrate including a first-SONOS region and a second-SONOS region. A first tunnel mask (TUNM) is formed over the HM exposing a first portion of the HM in the second-SONOS region. The first portion of the HM is etched, a channel for a first SONOS device implanted through a first pad oxide overlying the second-SONOS region and the first TUNM removed. A second TUNM is formed exposing a second portion of the HM in the first-SONOS region. The second portion of the HM is etched, a channel for a second SONOS device implanted through a second pad oxide overlying the first-SONOS region and the second TUNM removed. The first and second pad oxides are concurrently etched, and the HM removed. |
申请公布号 |
US2015171104(A1) |
申请公布日期 |
2015.06.18 |
申请号 |
US201414305122 |
申请日期 |
2014.06.16 |
申请人 |
Cypress Semiconductor Corporation |
发明人 |
Prabhakar Venkatraman;Ramkumar Krishnaswamy;Kouznetsov Igor |
分类号 |
H01L27/115;H01L21/266 |
主分类号 |
H01L27/115 |
代理机构 |
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代理人 |
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主权项 |
1. A method of manufacturing of a complementary silicon-oxide-nitride-oxide-silicon (SONOS) device, comprising:
depositing a hardmask (HM) over a surface of a substrate including a first-SONOS region and a second-SONOS region in which a pair of complementary P-SONOS and N-SONOS are to be formed concurrently; forming a first tunnel mask (TUNM) over the HM exposing a first portion of the HM in the second-SONOS region; etching the first portion of the HM, implanting a first channel for a first SONOS device through a first pad oxide overlying the second-SONOS region and removing the first TUNM; forming a second TUNM over the HM exposing a second portion of the HM in the first-SONOS region; etching the second portion of the HM, implanting a second channel for a second SONOS device through a second pad oxide overlying the first-SONOS region and removing the second TUNM, wherein the first and second channels include doping with opposite types of dopants; and concurrently etching the first and second pad oxides in the second-SONOS region and the first-SONOS region, and removing the HM in the first- and second-SONOS regions immediately afterwards. |
地址 |
San Jose CA US |