发明名称 COMPLEMENTARY SONOS INTEGRATION INTO CMOS FLOW
摘要 Methods of integrating complementary SONOS devices into a CMOS process flow are described. In one embodiment, the method begins with depositing a hardmask (HM) over a substrate including a first-SONOS region and a second-SONOS region. A first tunnel mask (TUNM) is formed over the HM exposing a first portion of the HM in the second-SONOS region. The first portion of the HM is etched, a channel for a first SONOS device implanted through a first pad oxide overlying the second-SONOS region and the first TUNM removed. A second TUNM is formed exposing a second portion of the HM in the first-SONOS region. The second portion of the HM is etched, a channel for a second SONOS device implanted through a second pad oxide overlying the first-SONOS region and the second TUNM removed. The first and second pad oxides are concurrently etched, and the HM removed.
申请公布号 US2015171104(A1) 申请公布日期 2015.06.18
申请号 US201414305122 申请日期 2014.06.16
申请人 Cypress Semiconductor Corporation 发明人 Prabhakar Venkatraman;Ramkumar Krishnaswamy;Kouznetsov Igor
分类号 H01L27/115;H01L21/266 主分类号 H01L27/115
代理机构 代理人
主权项 1. A method of manufacturing of a complementary silicon-oxide-nitride-oxide-silicon (SONOS) device, comprising: depositing a hardmask (HM) over a surface of a substrate including a first-SONOS region and a second-SONOS region in which a pair of complementary P-SONOS and N-SONOS are to be formed concurrently; forming a first tunnel mask (TUNM) over the HM exposing a first portion of the HM in the second-SONOS region; etching the first portion of the HM, implanting a first channel for a first SONOS device through a first pad oxide overlying the second-SONOS region and removing the first TUNM; forming a second TUNM over the HM exposing a second portion of the HM in the first-SONOS region; etching the second portion of the HM, implanting a second channel for a second SONOS device through a second pad oxide overlying the first-SONOS region and removing the second TUNM, wherein the first and second channels include doping with opposite types of dopants; and concurrently etching the first and second pad oxides in the second-SONOS region and the first-SONOS region, and removing the HM in the first- and second-SONOS regions immediately afterwards.
地址 San Jose CA US