SEMICONDUCTOR APPARATUS, METHOD FOR MANUFACTURING THE SAME AND ELECTRIC DEVICE

摘要

A semiconductor apparatus includes: a semiconductor device including a first electrode; a substrate including a second electrode and a recess; and a heat-dissipating adhesive material to set the semiconductor device in the recess so as to arrange the first electrode close to the second electrode, wherein the first electrode is coupled to the second electrode and the heat-dissipating adhesive material covers a bottom surface and at least part of a side surface of the semiconductor device.

主权项

1. A method for manufacturing a semiconductor apparatus, comprising:
preparing a semiconductor device including a first electrode; forming a recess on a substrate including a second electrode; disposing the semiconductor device in the recess such that the first electrode becomes close to the second electrode; covering the semiconductor device from a bottom surface to at least part of a side surface of the semiconductor device with a heat-dissipating adhesive material; and coupling the first electrode to the second electrode.