| 发明名称 |
Semiconductor Wafer And Semiconductor Die |
| 摘要 |
A semiconductor wafer includes a substrate, an integrated circuit and a die seal ring structure. The substrate is with a die region, a die seal ring region surrounding the die region and a scribe line region surrounding the die seal ring region. The substrate includes a first surface and a second surface opposite to the first surface, and periodic recesses within the first surface of the die seal ring region, the scribe line region or both the die seal ring region and the scribe line region. The integrated circuit is located on the first surface and the second surface of the die region. The die seal ring structure is located on the second surface of the die seal ring region. A semiconductor die is also provided. |
| 申请公布号 |
US2015170985(A1) |
申请公布日期 |
2015.06.18 |
| 申请号 |
US201314109162 |
申请日期 |
2013.12.17 |
| 申请人 |
Taiwan Semiconductor Manufacturing CO., LTD. |
发明人 |
Wu Hsi-Jung;Chien Volume;Wang Ying-Lang;Chen Hsin-Chi;Chen Ying-Hao;Huang Hung-Ta |
| 分类号 |
H01L23/10;H01L23/544;H01L23/00 |
主分类号 |
H01L23/10 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor wafer, comprising:
a substrate, with a die region, a die seal ring region surrounding the die region and a scribe line region surrounding the die seal ring region, comprising a first surface and a second surface opposite to the first surface, periodic recesses within the first surface of the die seal ring region, the scribe line region or both the die seal ring region and the scribe line region; an integrated circuit on the first surface and the second surface of the die region; and a die seal ring structure on the second surface of the die seal ring region. |
| 地址 |
Hsinchu TW |
