| 摘要 |
A light emitting diode assembly includes: a light emitting diode (LED) printed circuit board (PCB) having a base layer, an insulating layer on the base layer and a circuit pattern layer on the insulating layer, the LED PCB including a plurality of through holes spaced apart from each other; and a plurality of light emitting diodes (LEDs) inserted into the plurality of through holes, respectively, from a bottom surface of the LED PCB, each of the plurality of LEDs including a lead contacting the circuit pattern layer. |
