ELECTRONIC COMPONENT MOUNTING STRUCTURE AND PRINTED WIRING BOARD

摘要

An electronic component mounting structure includes a first land, a second land making a pair with the first land, an electronic component having a chip shape and including a first electrode connected to the first land and a second electrode connected to the second land, a first wiring pattern connected to the first land, and a second wiring pattern connected to the second land and including a first partial pattern overlapping a portion of a body of the electronic component in planar view, the portion being not covered with the pair of electrodes, a second partial pattern formed integral with the first partial pattern and overlapping the first electrode of the electronic component in planar view, and a third partial pattern formed integral with the second partial pattern and parallel to the first wiring pattern.

主权项

1. An electronic component mounting structure comprising:
a first land formed on a printed wiring board; a second land formed on the printed wiring board and making a pair with the first land; an electronic component having a chip shape and including a pair of electrodes formed on both sides of a body, a first electrode as one of the pair of electrodes being connected to the first land, and a second electrode as the other one of the pair of electrodes being connected to the second land; a first wiring pattern connected to the first land; and a second wiring pattern connected to the second land and including a first partial pattern overlapping a portion of the body of the electronic component in planar view, the portion being not covered with the pair of electrodes, a second partial pattern formed integral with the first partial pattern and overlapping the first electrode of the electronic component in planar view, and a third partial pattern formed integral with the second partial pattern and parallel to the first wiring pattern.