CAMERA MODULE

摘要

A camera module of the present invention, provided by adhering a glass substrate to the cover body so that the glass substrate covers an opening of a sensor cover for covering an image pickup element mounted on a wiring substrate, which opening is provided above the image pickup element, the camera module includes: an image pickup package having an internal space provided by the glass substrate, the sensor cover, and the glass substrate; and an image pickup lens provided above the glass substrate of the image pickup package, wherein at least one ventilation groove (G) for allowing the internal space to communicate with open air is provided on an adhesive surface of the glass substrate of the sensor cover.

主权项

1. A camera module, comprising:
an image pickup package including a substrate, an image pickup element on the substrate, and a cover body for covering the image pickup element on the substrate, a transparent plate being attached to the cover body in such a manner that the transparent plate covers an opening of the cover body which opening is above the image pickup element, so that the substrate, the cover body, and the transparent plate define an internal space; and an image pickup lens provided above the transparent plate of the image pickup package, wherein at least one ventilation groove for allowing the internal space to communicate with open air is provided on a plane of the cover body on which plane the transparent plate is attached.