发明名称 LIQUID SUPPLY UNIT
摘要 A technique of enhancing attachment of a liquid supply unit to a liquid ejection device is provided. A first ink cartridge 100a and a second ink cartridge 100b are attached to a carriage 27 of a printing device 10 via a holder structure 200. Each of the first and the second ink cartridges 100a and 100b includes a circuit substrate 130 having a plurality of terminals 151 to 159 which are electrically connected with a device-side terminal assembly 250 provided on the holder structure 200. Each of the first and the second ink cartridges 100a and 100b also includes a main engagement part 120 configured to engage with a lever member 230 of the holder structure 200 as an engaged part, such as to limit motion of the circuit substrate 130 away from the holder structure 200. The circuit substrate 130 includes a first terminal 151 and a second terminal 152 located on respective ends in an array direction of the terminals. The main engagement part 120 has a width greater than an interval between contact portions CP of the first and the second terminals 151 and 152 in the array direction of the terminals.
申请公布号 US2015165780(A1) 申请公布日期 2015.06.18
申请号 US201414573424 申请日期 2014.12.17
申请人 SEIKO EPSON CORPORATION 发明人 Shiota Takayuki;Kobayashi Atsushi;Mizutani Tadahiro;Oya Shun
分类号 B41J2/175 主分类号 B41J2/175
代理机构 代理人
主权项 1. A liquid supply unit configured to be attachable to and detachable to a liquid ejection device having an electrode assembly and an engaged part, the liquid supply unit comprising: a plurality of contact portions arrayed in an array direction to be electrically connectable with the electrode assembly; and an engagement part configured to be engageable with the engaged part, such as to limit a motion of the plurality of contact portions away from the liquid ejection device, wherein the plurality of contact portions includes a first contact portion and a second contact portion located on both ends in the array direction, and the engagement part has a width greater than an interval between the first contact portion and the second contact portion in the array direction.
地址 Tokyo JP