发明名称 COMMUNICATION MODULE
摘要 PROBLEM TO BE SOLVED: To provide a small high-functional communication module for mobile telephone. ! SOLUTION: A communication module 100' comprises: a circuit board 800 on which there are mounted a first high-frequency processing unit 610 involved in mobile phone communication, a second high-frequency processing unit 622 for processing a reception signal involved in a satellite positioning system, a system unit 630 including a baseband processing unit and an application processing unit, and a power supply circuit unit 640; a sealing member 900 that coats electronic components mounted on the circuit board 800; a conductive shield layer 901 formed on a surface of the sealing member 900; and a shield wall 902 formed in the sealing member 900 so as to separate a mounting region of the first high-frequency processing unit from a mounting region of the second high-frequency processing unit. ! COPYRIGHT: (C)2015,JPO&INPIT
申请公布号 JP2015111803(A) 申请公布日期 2015.06.18
申请号 JP20140054606 申请日期 2014.03.18
申请人 TAIYO YUDEN CO LTD 发明人 SAJI TETSUO ; ICHIKAWA YOHEI ; NAKAMURA HIROSHI
分类号 H04B1/38;H05K3/28 主分类号 H04B1/38
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