| 主权项 |
1. A method of manufacturing a printed circuit board,
the printed circuit board comprising: a first printed wiring board comprising a first electrode pad formed on a surface thereof; and a second printed wiring board comprising a second electrode pad formed on a surface thereof, the first electrode pad and the second electrode pad being joined with solder, the method comprising: forming, on the second printed wiring board: a first region in an outer edge portion of the second electrode pad, which is covered with solder resist; a second region on the second electrode pad, which is prevented from being covered with the solder resist; and a third region in an outer peripheral region of the second electrode pad adjacent to the second region, which is prevented from being covered with the solder resist; and joining the first electrode pad and the second electrode pad to each other by: supplying solder paste onto a region extending over the second region and the third region; mounting the first printed wiring board on the second printed wiring board so that the first electrode pad of the first printed wiring board is opposed to the second electrode pad of the second printed wiring board; heating the solder paste to be molten; and causing the molten solder to move from the third region toward the second region. |
