| 摘要 |
The invention relates to an optoelectronic component comprising a lead frame, a molded member that is connected to the lead frame, and an optoelectronic semiconductor chip that is arranged on the lead frame. The lead frame has an alignment hole. The molded member has a recess via which the lead frame is exposed in the region of the alignment hole. The invention further relates to a method for producing an optoelectronic component. |
