| 摘要 |
Provided is a chip resistance element manufacturing method, the chip resistance element including a substrate, a resistor on the substrate, and an electrode which is connected to both ends of the resistor. The method includes an electrode forming step for forming the electrode on the substrate. The electrode forming step comprises: a step for forming a first electrode layer on the substrate by using a first electrode material which contains silver; and a step for forming a second electrode layer on the first electrode layer by using a second electrode material which contains silver and palladium. The chip resistance element manufacturing method is characterized in that the first electrode material uses a material that contains more silver than the second electrode material. |
