发明名称 回路装置とその製造方法
摘要 A circuit device includes a heat detection component including lead terminals and a heat detection element, a heat-generating electronic component including lead terminals, and a substrate including a wiring pattern, holes, and lands, the heat detection component and the heat-generating electronic component being electrically connected to the substrate through the lead terminals thereof, wherein the lead terminals of the heat detection component are bent into a U-shaped or substantially U-shaped configuration such that the bent lead terminals are partly contacted with the heat-generating electronic component, and the heat-generating electronic component is sandwiched between portions of the lead terminals and the heat detection element of the heat detection component.
申请公布号 JP5737252(B2) 申请公布日期 2015.06.17
申请号 JP20120210257 申请日期 2012.09.25
申请人 株式会社村田製作所 发明人 福元 光輝
分类号 H05K1/18;H01H37/76 主分类号 H05K1/18
代理机构 代理人
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