| 摘要 |
PROBLEM TO BE SOLVED: To provide a power module which reduces the thickness and improves the insulation quality, and to provide a manufacturing method of the power module.SOLUTION: A power module 50 according to an embodiment of this invention includes: a wiring board 10 having a land part 12b; a semiconductor chip 26 having a terminal part 26a on an upper surface and mounted on the wiring board 10; a flexible printed board 20 provided above the wiring board 10 so as to cover the semiconductor chip 26 and the land part 12b and electrically connecting the land part 12b with the terminal part 26a; and an insulative resin part 41 filling a space between the wiring board 10 and the flexible printed board 20 and allowing the semiconductor chip 26 to be embedded therein. |
