发明名称 フェノール性樹脂、エポキシ樹脂、それらの製造方法、エポキシ樹脂組成物及び硬化物
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a phenolic resin and an epoxy resin imparting a cured product excellent in high thermal decomposition stability, high heat resistance, low thermal expansion, flame retardancy, low hygroscopicity or the like, and to provide a method for manufacturing them, an epoxy resin composition using the epoxy resin and its cured product. <P>SOLUTION: The phenolic resin is represented by general formula (1), and the epoxy resin is obtained by reacting the phenolic resin with epichlorohydrin. The epoxy resin composition contains the epoxy resin or the phenolic resin as an essential ingredient, and the cured product is obtained by curing the epoxy resin composition. (In the formula, X represents a single bond, -CH<SB POS="POST">2</SB>-, -CH(Me)-, -CH(Me)<SB POS="POST">2</SB>-, -CO-, -O-, -S- or -SO<SB POS="POST">2</SB>-, and m represents a number of 1-15). <P>COPYRIGHT: (C)2012,JPO&INPIT</p>
申请公布号 JP5734603(B2) 申请公布日期 2015.06.17
申请号 JP20100191882 申请日期 2010.08.30
申请人 发明人
分类号 C07D303/27;C07D301/28;C08G59/06;C08G59/62;C08G65/40;C08K3/00;C08L63/00 主分类号 C07D303/27
代理机构 代理人
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