发明名称 Header for electronic cooler
摘要 A fluid cooler packet (141) for a plurality of electronic components has a plurality of individual cooling circuits for receiving a supply of cooling fluid from a supply header (S) and delivering that cooling fluid to an associated electronic component (22). The plurality of cooling circuits each includes a return passage for receiving a return fluid after having cooled the associated electronic component, and returns the return fluid to a return header (R). A volume of the supply header (S) decreases in a downstream direction as it passes over the plurality of individual cooling circuits. A volume of the return header (R) increases as it moves in a downstream direction over the plurality of individual cooling circuits.
申请公布号 EP2833403(A3) 申请公布日期 2015.06.17
申请号 EP20140178071 申请日期 2014.07.22
申请人 HAMILTON SUNDSTRAND CORPORATION 发明人 HIMMELMANN, RICHARD A.;TURNEY, JOSEPH
分类号 H01L23/473;F28D15/00;H05K7/20 主分类号 H01L23/473
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