发明名称 |
Header for electronic cooler |
摘要 |
A fluid cooler packet (141) for a plurality of electronic components has a plurality of individual cooling circuits for receiving a supply of cooling fluid from a supply header (S) and delivering that cooling fluid to an associated electronic component (22). The plurality of cooling circuits each includes a return passage for receiving a return fluid after having cooled the associated electronic component, and returns the return fluid to a return header (R). A volume of the supply header (S) decreases in a downstream direction as it passes over the plurality of individual cooling circuits. A volume of the return header (R) increases as it moves in a downstream direction over the plurality of individual cooling circuits. |
申请公布号 |
EP2833403(A3) |
申请公布日期 |
2015.06.17 |
申请号 |
EP20140178071 |
申请日期 |
2014.07.22 |
申请人 |
HAMILTON SUNDSTRAND CORPORATION |
发明人 |
HIMMELMANN, RICHARD A.;TURNEY, JOSEPH |
分类号 |
H01L23/473;F28D15/00;H05K7/20 |
主分类号 |
H01L23/473 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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