| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a ceramic wiring board for a probe card, which hardly causes displacement between a measuring terminal disposed on the ceramic wiring board for a probe card and a measuring pad formed on a surface of a Si wafer during a heat load test, has no poor appearance with foreign matter adhesion, and achieves high chemical resistance; and a probe card using the same. <P>SOLUTION: A ceramic sintered body contains 2.0 to 4.0 pts.mass of Mn in terms of Mn<SB POS="POST">2</SB>O<SB POS="POST">3</SB>, 4.0 to 8.0 pts.mass of Ti in terms of TiO<SB POS="POST">2</SB>, and 0.4 to 1.2 pts.mass of Mo in terms of MoO<SB POS="POST">3</SB>relative to 100 pts.mass of mullite, with grain boundaries having W-Mo alloy. In X-ray diffraction, the ceramic sintered body has a ratio of the diffraction intensity of the main peak of the Mo-W alloy to the diffraction intensity of the main peak of the mullite of 0.17 to 0.90. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
