| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device and a method of manufacturing the same while suppressing increase in thickness and reducing planar dimensions. <P>SOLUTION: A semiconductor device 10 comprises: a circuit element D mounted on a main surface side MF of a lead frame RM; an inductor 12 mounted on a back surface side BF of the lead frame RM; and a resin body 14 which seals the circuit element D and the inductor 12 with a resin. An MIC 18, which is a monolithic integrated circuit, is included in the circuit element D. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
