| 摘要 |
<p>Provided is an electronic device (510) that prevents running-out of a filling resin from an opening (e.g., an injection gate (81)) due to thermal expansion, even when the device is manufactured using a resin having a linear expansion coefficient of at least 90×10 -6 /°C (90 ppm/°C) (e.g., a hot melt resin), and is used under a high-temperature environment (e.g., 50°C or more). The electronic device (510) is provided with a filling resin confining surface inside of the casing (60; 60K; 60L; 60M), and the filling resin confining surface includes a position opposite to the gate (81) and a region that has a distance to an inner surface (63; 63M) of the casing (60; 60K; 60L; 60M) of at least 0.2 mm and at most 1.0 mm, and that has an area of at least four times larger than the cross-sectional area of the gate (81).</p> |
