| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a white curable composition for semiconductor devices having excellent curability and producing a cured product hardly causing yellowing. <P>SOLUTION: The white curable composition for semiconductor devices includes: an epoxy compound; an acid anhydride curing agent; titanium oxide; and a filler other than titanium oxide. At least one component among the titanium oxide and the filler includes an ingredient showing pH of >7 and ≤11 in pH measurement of a liquid obtained by filling up a boiled liquid, which is prepared by adding 5 g of the component to 100 mL of pure water, heating the mixture to boil it for 5 minutes, and leaving it until its temperature reach 23°C, to a volume of 100 mL by adding water in an amount of water evaporated by boiling. <P>COPYRIGHT: (C)2013,JPO&INPIT |
