| 摘要 |
PROBLEM TO BE SOLVED: To provide a modified phenoxy resin curable by irradiation of light and impartation of heat, a curable composition using the modified phenoxy resin, and a connection structure using the curable composition.SOLUTION: The modified phenoxy resin is a modified phenoxy resin in which a thiirane group and an unsaturated double bond are incorporated in a phenoxy resin, and has the thiirane group and the unsaturated double bond. The curable composition includes the modified phenoxy resin having the thiirane group and the unsaturated double bond, a photopolymerization initiator, and a thermosetting agent. The connection structure 1 comprises a first connection target member 2, a second connection target member 4, and a connection part 3 connecting the first and second connection target members 2 and 4. The connection part 3 is formed of the curable composition. |
