发明名称 透光性硬質基板積層体の製造方法及び透光性硬質基板貼り合わせ装置
摘要 <p>Provided is a method of manufacturing a translucent rigid substrate laminate to improve a positional precision while increasing production efficiency. Further, a translucent rigid substrate bonding apparatus contributing to improvement of the positional precision while increasing production efficiency of a plate-shaped product is provided. In the method of manufacturing the translucent rigid substrate laminate and the translucent rigid substrate bonding apparatus according to the present invention, when translucent rigid substrates are bonded in a predetermined positional relationship by interposing a photo-curable fixing agent therebetween, only the fixing agent present on an outer boundary portion of both translucent rigid substrates is cured for provisional fastening.</p>
申请公布号 JP5734876(B2) 申请公布日期 2015.06.17
申请号 JP20110550884 申请日期 2011.01.13
申请人 发明人
分类号 C03C27/12;B65H37/04;G09F9/00;H01L21/683 主分类号 C03C27/12
代理机构 代理人
主权项
地址