发明名称 塗布装置及び塗布方法
摘要 The invention provides a coating device. The coating device can protect circumferential edge parts comprising end faces of a circuit board, prevents dust generation from the end parts of the circuit board indeed and can coat film forming liquid thinly and uniformly at the circumferential edge parts comprising the end faces of the circuit board. The coating device (1) is a coating device for coating liquid at the circumferential edge parts comprising the end faces of the circuit board (2). The coating device comprises a support table used for supporting the circuit board (2), a coating unit (20) comprising a pair of coating rollers (22a) (22b) arranged to be opposite to each other and used for clamping the end part of the circuit board (2), a moving unit (40) used for moving the coating unit (20), a liquid supply unit (50) used for supplying film forming liquid (56) for the pair of coating rollers (22a) (22b), a control section (70) used for controlling the moving unit (40), and thus the pair of coating rollers (22a) (22b) can move along the circumferential edge parts of the circuit board (2) when the pair of coating rollers (22a) (22b) clamp the end parts of the circuit board (2) supported by the support table (10).
申请公布号 JP5735047(B2) 申请公布日期 2015.06.17
申请号 JP20130130229 申请日期 2013.06.21
申请人 株式会社エナテック 发明人 松山 隆勇
分类号 B05C1/02;B05C11/10;B05D1/28 主分类号 B05C1/02
代理机构 代理人
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