| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition that can be cured at low temperature, has excellent positive lithography performances such as high sensitivity and high resolution and can produce a patterned cured film with a good shape, and furthermore can be cured in a low-temperature process and therefore allow damage to a device to be avoided and a reliable electronic component to be obtained, and to provide a method of manufacturing a surface protective film and an insulator film using the composition. <P>SOLUTION: A positive photosensitive resin composition contains (A) polyimide having carboxyl group, (B) thermoset resin, and (C) photoacid generator. <P>COPYRIGHT: (C)2013,JPO&INPIT |
