INTEGRATED HEAT EXCHANGE ASSEMBLY AND AN ASSOCIATED METHOD THEREOF

摘要

A heat exchange assembly for dissipating heat from a hot component of a circuit card is disclosed. The heat exchange assembly includes a support structure (100) having a first support end (102), a second support end (104), and a support portion (106) extending between the first support end (102) and the second support end (104). The support structure (100) further includes a plurality of first projections (118) protruding from a portion of a surface of the support structure (100), corresponding to the support portion (106). Further, the heat exchange assembly includes a vapor chamber (120) having a casing (122) and a wick disposed within the casing (122). The vapor chamber (120) is coupled to a surface of the support structure (100).