| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a cathode unit capable of equalizing a film thickness at high accuracy, and to provide a film deposition system. <P>SOLUTION: The cathode unit 15 includes: a target material 17 arranged in a sputtering chamber 13; a backing plate 19 to which the target material is attached; and a magnet 29 arranged on the back side of the backing plate at predetermined intervals, wherein the cathode unit has a magnetic field strength-adjusting mechanism 100. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
