NORMAL TEMPERATURE BONDING DEVICE AND NORMAL TEMPERATURE BONDING METHOD

摘要

The purpose of the present invention is to suppress adhering of impurities to substrates and intermediate layers during normal temperature bonding of substrates. This normal temperature bonding device is provided with: a vacuum vessel (1); a first holding mechanism (3a) that holds a first substrate (4); a second holding mechanism (3b) that holds a second substrate (4); a beam source (6) that outputs an activated beam that irradiates surfaces to be bonded of the first substrate (4) and the second substrate (4); and a pressure bonding mechanism (5) that aligns and bonds the surfaces to be bonded of both substrates (4) to which a target material has been made to adhere. At least one of the vacuum vessel (1), the first and second holding mechanisms (3a, 3b), the beam source (6) and the pressure bonding mechanism (5) is formed from or covered with a first material that is not easily sputtered by the activated beam (6) or that does not inhibit the function of devices formed by bonding the two substrates (4) even when present on the surfaces to be bonded.