PRESSURE SENSITIVE ADHESIVE COMPOSITION

摘要

The present invention relates to an adhesive composition, an adhesive film, and a conductive laminate. Provided in the present invention is an adhesive composition forming an adhesive layer having proper level of low rate and high rate peeling force for various objects. Provided in the present invention is an adhesive composition forming an adhesive layer having proper adhesive properties and peeling properties from a material applied in a high temperature process such as an ITO film for example by having excellent heat resistance.