| 摘要 |
<P>PROBLEM TO BE SOLVED: To enable diversion of existing inline equipment in application of a semiconductor adhesion tape; inhibit contact of a wafer and a cutting blade, contamination of cutting scraps and displacement of a cutting position which occur at the time of tape cutting; and prevent a wafer damage occurring at the time of peeling a base material tape having an adhesive layer. <P>SOLUTION: A semiconductor device manufacturing method comprises: forming a laminate by attaching to a semiconductor wafer, a semiconductor adhesive tape also used for wafer thinning, which includes a base material film having an adhesive layer and an adhesive film, in a state where the adhesive film side faces a circuit face having a plurality of protruding electrodes of the semiconductor wafer; polishing the laminate from a rear face side; attaching a dicing tape to the rear face side of the laminate in a state where the semiconductor adhesive tape is attached to the circuit face side; peeling the base material film and dicing the laminate from the adhesive film side to obtain a plurality of semiconductor chips with adhesive films; and subsequently, mounting the semiconductor chips on support media, respectively. The step of mounting the semiconductor chips includes thermal pressure bonding the semiconductor chip with the support medium at a temperature within a range of 100-250°C for 0.1-30 seconds to connect the semiconductor chip with the adhesive film and the support medium. <P>COPYRIGHT: (C)2013,JPO&INPIT |
