| 摘要 |
<p>The chip has a layer assembly (2) for manufacturing a soldering connection on a side of a chip body (1) and comprising precious metal layers (6). A soldering layer (5) is provided between the metal layers and the body, where the metal layers are formed by a physical coating method. The soldering layer includes limiting surfaces that are formed by an interruption of the coating method. An intermediate layer (4) made material e.g. titanium, chromium or tungsten, is provided between the soldering layer and a base layer (3) that is made from aluminum.</p> |
