| 摘要 |
<p>According to an embodiment, a camera module comprises: a printed circuit substrate in which an image sensor is installed; a holder member combined with the printed circuit substrate; a lens barrel having at least one lens; a sealing member interposed between the lens barrel and the holder member, where an outer circumference surface adheres to the inside of the holder member, and an inner circumference surface adheres to the outside of the lens barrel; and at least two first and second pressurization bumps protruding on the outer circumference surface and the inner circumference surface of the sealing member.</p> |
