Curable composition

摘要

Provided are a curable composition and its use. The curable composition may provide a cured product having excellent processability, workability, and adhesive property, and having no whitening and surface stickiness. The curable composition has excellent thermal resistance and crack resistance, and low gas permeability, and thus provides a device having excellent initial performance when being applied to a semiconductor device and maintaining stable performance when being used at a high temperature for a long time.

主权项

1. A curable composition, comprising:
(A) a mixture of a first crosslinked polyorganosiloxane including a siloxane unit of Formula A and a siloxane unit of Formula B, having a ratio (B/(A+B)) of a molar ratio (B) of the siloxane unit of Formula B to a molar ratio (A+B) of the sum of the siloxane units of Formulas A and B of 0.1 to 0.35, and having a molar ratio (Ar/Si) of an aryl (Ar) group to a silicon (Si) atom of 0.3 or less, and a second crosslinked polyorganosiloxane including a siloxane unit of Formula A and a siloxane unit of Formula B, having a ratio (B/(A+B)) of a molar ratio (B) of the siloxane unit of Formula B to a molar ratio (A+B) of the sum of the siloxane units of Formulas A and B, which is different from that of the first crosslinked polyorganosiloxane, of 0.2 to less than 1, and having a molar ratio (Ar/Si) of an aryl (Ar) group to a silicon (Si) atom of 0.3 or less; and (B) a polyorganosiloxane including a hydrogen atom and an aryl group, which bind to a silicon atom, having a molar ratio of an aryl (Ar) group to a silicon (Si) atom of 0.25 or more, and having 3 to 10 silicon atoms:
(Ra3SiO1/2)  [Formula A](RbRa2SiO1/2)  [Formula B] where Ra is an alkyl group, and Rb is an alkenyl group.