半导体积层用接着剂组成物;ADHESIVE COMPOSITION FOR SEMICONDUCTOR LAMINATION

摘要

提供一种半导体积层用接着剂组成物，其在涂布后，藉由加热乾燥，不到50℃的温度时不具有接着性，藉由在可抑制半导体晶片破损的温度之加热则会显现接着性，然后，迅速的硬化而形成接着剂层。;本发明的半导体积层用接着剂组成物系含有聚合性化合物(A)、阳离子聚合起始剂(B1)及/或阴离子聚合起始剂(B2)及溶剂(C)。;聚合性化合物(A)：含有80重量%以上的软化点或熔点为50℃以上之环氧化合物；阳离子聚合起始剂(B1)：在3,4-环氧基环己基甲基(3,4-环氧基)环己烷羧酸酯100重量份中添加1重量份而得的组成物之在130℃的热硬化时间为3.5分钟以上；阴离子聚合起始剂(B2)：在双酚A二缩水甘油醚100重量份中添加1重量份而得的组成物之在130℃的热硬化时间为3.5分钟以上。;The present adhesive composition for semiconductor lamination comprises a polymerizable compound (A), a cation polymerization initiator(B1) and/or an anion polymerization initiator(B2) and a solvent (C). ;Polymerizable compound (A): comprises 80 weight% or more of an epoxy compound having a soften point or melting point of 50℃; Cation polymerization initiator(B1): a composition obtained by adding 1 part by weight into a 3,4-epoxycyclohexylmethyl (3,4-epoxy)cyclohexanecarboxylate 100 part by weight, which has a thermal curing time of 3.5 minutes or more at 130℃; Anion polymerization initiator(B2): a composition obtained by adding 1 part by weight into a bisphenol A diglycidyl ether 100 part by weight, which has a thermal curing time of 3.5 minutes or more at 130℃.