Radiation image pickup apparatus, radiation image pickup system, and method for manufacturing radiation image pickup apparatus

摘要

A radiation image pickup apparatus includes a base, at least one image pickup element, a scintillator, a first heat peelable adhesive layer which is arranged between the base and the image pickup element and which fixes the base and the image pickup element, and a second heat peelable adhesive layer which is arranged between the image pickup element and the scintillator and which fixes the image pickup element and the scintillator, and in the radiation image pickup element described above, the first heat peelable adhesive layer contains first heat-expandable microspheres, the second heat peelable adhesive layer contains second heat-expandable microspheres, and the first heat-expandable microspheres have a different expansion starting temperature from that of the second heat-expandable microspheres.

主权项

1. A radiation image pickup apparatus comprising:
a base; at least one image pickup element including a plurality of pixels, each of which has a sensor portion converting light into a charge; a scintillator arranged on the image pickup element at a side opposite to the base; a first heat peelable adhesive layer which is arranged between the base and the image pickup element and which fixes the base and the image pickup element; and a second heat peelable adhesive layer which is arranged between the image pickup element and the scintillator and which fixes the image pickup element and the scintillator, wherein the first heat peelable adhesive layer contains first heat-expandable microspheres, the second heat peelable adhesive layer contains second heat-expandable microspheres, and the first heat-expandable microspheres have a different expansion starting temperature from that of the second heat-expandable microspheres.