Semiconductor device and the method of manufacturing the same

摘要

A method for manufacturing a semiconductor device is provided with: a step of preparing a semiconductor wafer (22) in a state where the circumference of the semiconductor wafer, which has been divided into semiconductor device parts, is adhered on a dicing sheet (21) supported by a wafer ring (23); a step of fixing the wafer ring (23) after transferring the wafer ring to a table (14) where laser printing is to be performed; and a step of marking on the main surface where the semiconductor material of the semiconductor device parts which configure the semiconductor wafer (22) is exposed, by radiating laser beams through the dicing sheet and an adhesive layer.

主权项

1. A semiconductor device comprising:
a semiconductor substrate having an element region formed therein and including a first main surface and a second main surface opposite to each other; a wiring layer provided on a side of the first main surface of the semiconductor substrate and connected to the element region; and a marking formed by applying a laser on the second main surface of the semiconductor substrate, wherein the marking is provided with a plurality of recesses separated from each other by peripheral portions, carbide of resin regions are directly attached to the plurality of recesses and the peripheral portions as a continuous layer, and one of the carbide of resin regions adjacent to another one of the carbide of resin regions partially overlap each other.