Embedded semiconductor die package and method of making the same using metal frame carrier

摘要

An embedded semiconductor die package is made by mounting a frame carrier to a temporary carrier with an adhesive. The frame carrier includes die mounting sites each including a leadframe interconnect structure around a cavity. A semiconductor die is disposed in each cavity. An encapsulant is deposited in the cavity over the die. A package interconnect structure is formed over the leadframe interconnect structure and encapsulant. The package interconnect structure and leadframe interconnect structure are electrically connected to the die. The frame carrier is singulated into individual embedded die packages. The semiconductor die can be vertically stacked or placed side-by-side within the cavity. The embedded die packages can be stacked and electrically interconnected through the leadframe interconnect structure. A semiconductor device can be mounted to the embedded die package and electrically connected to the die through the leadframe interconnect structure.

主权项

1. A method of making a semiconductor device, comprising:
providing a first interconnect structure; disposing a first semiconductor die within a cavity of the first interconnect structure; depositing an encapsulant over the first semiconductor die; and forming a first conductive layer over the first semiconductor die and a first surface of the encapsulant.