半导体晶片之雷射切割方法;A LASER CUTTING METHOD FOR SEMICONDUCTOR CHIP

摘要

一种半导体晶片之雷射切割方法，其包括有以下步骤：步骤一，提供一半导体晶片，该半导体晶片具有包括：设有复数个电路元件之一正面、以及一背面，并将该半导体晶片加以翻转使该背面朝上且该正面朝下；步骤二，于一胶带基材膜上涂布有一胶层，并将该半导体晶片之该正面贴附于该胶层上，并对该胶层加热使该胶层填充于该胶带基材膜与该半导体晶片间之空隙中；以及，步骤三，藉由一雷射切割器于该半导体晶片之该背面且位于各别之该电路元件之间所预设之一雷射切割道上进行雷射全切穿切割，以形成复数个具有该电路元件之晶粒。; Step Two: providing a tape film having a glue layer smeared thereon, and pasting the front surface of semiconductor chip onto the glue layer, and then heating the glue layer in order to let the glue layer filling the gaps between the tape film and the semiconductor chip; and Step Three: using a laser cutter to cut through the cutting paths predefined between the circuitries in order to form a plurality of chips each having the circuitries; wherein the laser cutter cuts the semiconductor chip from the rear surface.