Light-emitting semiconductor packages and related methods

摘要

Light-emitting semiconductor packages and related methods. The light-emitting semiconductor package includes a central barrier, a plurality of leads, a light-emitting device, a first encapsulant, a package body, and a second encapsulant. The light-emitting device is disposed in the interior space defined by the central barrier and is electrically connected to the leads surrounding the central barrier. The light-emitting device includes upper and lower light-emitting surfaces. The first encapsulant and the second encapsulant cover the upper and lower light-emitting surfaces, respectively. The package body encapsulates portions of the central barrier, portions of each of the leads, and the first encapsulant. The light-emitting semiconductor package can emit light from both the upper and lower sides thereof.

主权项

1. A light-emitting semiconductor package, comprising:
a central barrier defining an interior space; a plurality of leads surrounding the central barrier, and electrically isolated from each other; a light-emitting device disposed in the interior space and having an upper light-emitting surface and a lower light-emitting surface, the light-emitting device being electrically connected to the plurality of leads; a first encapsulant covering the upper light-emitting surface of the light-emitting device; a package body encapsulating portions of the central barrier, portions of each of the plurality of leads, and the first encapsulant; and a second encapsulant, covering the lower light-emitting surface of the light-emitting device, wherein light emitted from the lower light-emitting surface of the light-emitting device is capable of passing through the second encapsulant; wherein portions of the first and second encapsulants are located within the interior space and laterally restricted by the central barrier, wherein side portions of the central barrier and the plurality of leads each include an upper sloped portion, a lower sloped portion, and peaks at a junction of the upper and lower sloped portions, and the first encapsulant contacts the second encapsulant near the peaks of the plurality of leads within the interior space.