发明名称 |
Inhibiting propagation of imperfections in semiconductor devices |
摘要 |
Aspects of the disclosure provide a method of inhibiting crack propagation in a silicon wafer. In one embodiment, a method of repairing an imperfection on a surface of a semiconductor device is disclosed. The method includes: screening for imperfections on a surface of a silicon wafer of a semiconductor device; and in response to at least one imperfection on the surface of the silicon wafer, depositing a material on the surface of the silicon wafer. |
申请公布号 |
US9059097(B2) |
申请公布日期 |
2015.06.16 |
申请号 |
US201213570426 |
申请日期 |
2012.08.09 |
申请人 |
International Business Machines Corporation |
发明人 |
Ayotte Stephen P.;Hill David J.;Richard Glen E.;Sullivan Timothy M.;Truax Heather M. |
分类号 |
H01L21/00;H01L21/469;H01L21/302;H01L23/31;H01L21/312;H01L21/3105;H01L29/34;H01L29/32;H01L21/66 |
主分类号 |
H01L21/00 |
代理机构 |
Hoffman Warnick LLC |
代理人 |
Cain David A.;Hoffman Warnick LLC |
主权项 |
1. A method of repairing an imperfection on a surface of a semiconductor device, comprising:
detecting imperfections on a surface of a silicon wafer of a semiconductor device; and in response to at least one imperfection being detected on the surface of the silicon wafer, depositing a material only within each detected imperfection, wherein the material includes an organic epoxy, the organic epoxy comprising a two-part system selected from the group consisting of: polyoxypropylenediamine, aliphatic amine, or alkyl phenol, and an epoxy resin; and nonylphenol or aminoethylpiperazine, and bisphenol A diglycidylether resin. |
地址 |
Armonk NY US |