发明名称 Inhibiting propagation of imperfections in semiconductor devices
摘要 Aspects of the disclosure provide a method of inhibiting crack propagation in a silicon wafer. In one embodiment, a method of repairing an imperfection on a surface of a semiconductor device is disclosed. The method includes: screening for imperfections on a surface of a silicon wafer of a semiconductor device; and in response to at least one imperfection on the surface of the silicon wafer, depositing a material on the surface of the silicon wafer.
申请公布号 US9059097(B2) 申请公布日期 2015.06.16
申请号 US201213570426 申请日期 2012.08.09
申请人 International Business Machines Corporation 发明人 Ayotte Stephen P.;Hill David J.;Richard Glen E.;Sullivan Timothy M.;Truax Heather M.
分类号 H01L21/00;H01L21/469;H01L21/302;H01L23/31;H01L21/312;H01L21/3105;H01L29/34;H01L29/32;H01L21/66 主分类号 H01L21/00
代理机构 Hoffman Warnick LLC 代理人 Cain David A.;Hoffman Warnick LLC
主权项 1. A method of repairing an imperfection on a surface of a semiconductor device, comprising: detecting imperfections on a surface of a silicon wafer of a semiconductor device; and in response to at least one imperfection being detected on the surface of the silicon wafer, depositing a material only within each detected imperfection, wherein the material includes an organic epoxy, the organic epoxy comprising a two-part system selected from the group consisting of: polyoxypropylenediamine, aliphatic amine, or alkyl phenol, and an epoxy resin; and nonylphenol or aminoethylpiperazine, and bisphenol A diglycidylether resin.
地址 Armonk NY US