Conductive bump, semiconductor chip and stacked semiconductor package using the same

摘要

A conductive bump includes a step member formed to form a step on a portion of a connection pad; and a conductive member formed on the connection pad and the step member and having an inclined surface which is inclined with respect to the connection pad.

主权项

1. A semiconductor chip comprising:
a semiconductor substrate having a first surface and a second surface which faces away from the first surface; a through via formed to pass through the first surface and the second surface of the semiconductor substrate; and an upper bump having a step member formed on a portion of the through via and having the shape of a hemisphere, and a conductive member formed directly on the through via and the step member to have an inclined surface, wherein the conductive member substantially functions as a substantial bump.