Simultaneous controlled depth hot embossing and active side protection during packaging and assembly of wide bandgap devices

摘要

A method of mounting a plurality of semiconductor or microelectronic chips or dies, the method including providing a carrier, temporarily adhering the plurality of semiconductor or microelectronic chips or dies to the carrier with active faces of the chips or dies facing towards the carrier, covering backsides of the chips and filling empty spaces between the chips or dies with a metallic material to thereby define an assembly of the chips or dies and the metallic material, and releasing the assembly from the carrier, wherein each chip or die comprises at least one bonding ring higher than a height of the active face of the respective chip or die or any connections on the active face of the respective chip or die.

主权项

1. A method of mounting a plurality of semiconductor or microelectronic chips or dies, comprising:
providing a carrier; temporarily adhering said plurality of semiconductor or microelectronic chips or dies to said carrier with active faces of said chips or dies facing towards said carrier; covering backsides of said chips or dies and filling empty spaces between said chips or dies with a metallic material to thereby define an assembly of said chips or dies and said metallic material; and releasing the assembly from said carrier; wherein each chip or die comprises at least one bonding ring having a height from the active face of the respective chip or die that is greater than a maximum height of surface topography on the active face of the respective chip or die; wherein each bonding ring comprises a first bonding ring around the active face of the respective chip or die, and a second bonding ring around the active face of the respective chip or die; wherein the first bonding ring is higher than the second bonding ring; and wherein the second bonding ring has a larger area than the first bonding ring.