Semiconductor package with a bridge interposer

摘要

There are disclosed herein various implementations of semiconductor packages including a bridge interposer. One exemplary implementation includes a first active die having a first portion situated over the bridge interposer, and a second portion not situated over the bridge interposer. The semiconductor package also includes a second active die having a first portion situated over the bridge interposer, and a second portion not situated over the bridge interposer. The second portion of the first active die and the second portion of the second active die include solder balls mounted on a package substrate, and are configured to communicate electrical signals to the package substrate utilizing the solder balls and without utilizing through-semiconductor vias (TSVs).

主权项

1. A semiconductor package comprising:
a bridge interposer comprising an interposer dielectric, wherein the bridge interposer is devoid of conductive through-vias; a first active die having a first portion situated over said bridge interposer, and a second portion not situated over said bridge interposer; a second active die having a first portion situated over said bridge interposer, and a second portion not situated over said bridge interposer; said second portion of said first active die and said second portion of said second active die including solder balls configured to be mounted on a package substrate; said first active die and said second active die are configured to communicate electrical signals to said package substrate utilizing said solder balls and without utilizing through-semiconductor vias (TSVs).