Composite wiring board with electrical through connections

摘要

A composite wiring circuit with electrical through connections and method of manufacturing the same. The composite wiring circuit includes a glass with first electrically-conducting through vias. The first electrically-conducting through vias pass from a top surface of the glass layer to a bottom surface of the glass layer. The composite wiring circuit further includes an interposer layer with second electrically-conducting through vias. The second electrically-conducting through vias pass from a top surface of the interposer layer to a bottom surface of the interposer layer. The second electrically-conducting through vias are electrically coupled to the first electrically-conducting through vias.

主权项

1. A composite wiring circuit with electrical through connections, the composite wiring circuit comprising:
a glass layer with first electrically-conducting through vias, the first electrically-conducting through vias passing from a top surface of the glass layer to a bottom surface of the glass layer, the first electrically-conducting through vias including a first pitch; an interposer layer with second electrically-conducting through vias, the second electrically-conducting through vias passing from a top surface of the interposer layer to a bottom surface of the interposer layer, the second electrically-conducting through vias including a second pitch that is smaller than the first pitch; a first redistribution wiring layer carried by the top surface of the interposer layer which faces the glass layer, the first redistribution wiring layer electrically coupling the first electrically-conducting through vias and the second electrically-conducting through vias; and a first coupling layer, wherein the first coupling layer electrically couples a top surface of first electrically-conducting through vias and a bottom surface of the second electrically-conducting through vias; wherein the first electrically-conducting through vias include a first diffusion barrier carried by the top surface of the first electrically-conducting through vias, the first diffusion barrier is electrically coupled to the top surface of the first electrically-conducting through vias, and the first coupling layer is electrically coupled to a top surface of the first diffusion barrier; wherein the second electrically-conducting through vias include a second diffusion barrier carried by the bottom surface of the second electrically-conducting through vias, the first coupling layer is electrically coupled to a bottom surface of the second diffusion barrier, and the bottom surface of the second diffusion barrier is electrically coupled to the bottom surface of the second electrically-conducting through vias; and wherein the first diffusion barrier and the second diffusion barrier include ball limiting metallurgy pads.