发明名称 |
Integrated circuit diode |
摘要 |
A method includes forming isolation regions in a semiconductor substrate to define a first field effect transistor (FET) region, a second FET region, and a diode region, forming a first gate stack in the first FET region and a second gate stack in the second FET region, forming a layer of spacer material over the second FET region and the second gate stack, forming a first source region and a first drain region in the first FET region and a first diode layer in the diode region using a first epitaxial growth process, forming a hardmask layer over the first source region, the first drain region, the first gate stack and a portion of the first diode layer, and forming a second source region and a second drain region in the first FET region and a second diode layer on the first diode layer using a second epitaxial growth process. |
申请公布号 |
US9059014(B2) |
申请公布日期 |
2015.06.16 |
申请号 |
US201313870220 |
申请日期 |
2013.04.25 |
申请人 |
International Business Machines Corporation |
发明人 |
Cheng Kangguo;Kerber Pranita;Khakifirooz Ali;Shahidi Ghavam G. |
分类号 |
H01L21/70;H01L27/07;H01L21/8234;H01L21/84;H01L27/06;H01L27/12 |
主分类号 |
H01L21/70 |
代理机构 |
Cantor Colburn LLP |
代理人 |
Cantor Colburn LLP ;Alexanian Vazken |
主权项 |
1. A semiconductor device, comprising:
isolation regions formed in a semiconductor substrate to define a first field effect transistor (FET) region, a second FET region, and a diode region; a first gate stack formed in the first FET region and a second gate stack formed in the second FET region; a first epitaxial source region and a first epitaxial drain region formed in the first FET region and a first epitaxial diode layer formed in the diode region; and a second epitaxial source region and a second epitaxial drain region formed in the second FET region and a second epitaxial diode layer formed on the first epitaxial diode layer. |
地址 |
Armonk NY US |