发明名称 |
Eddy current thickness measurement apparatus |
摘要 |
A sheet of a material is disposed in a melt of the material. The sheet is formed using a cooling plate in one instance. An exciting coil and sensing coil are positioned downstream of the cooling plate. The exciting coil and sensing coil use eddy currents to determine a thickness of the solid sheet on top of the melt. |
申请公布号 |
US9057146(B2) |
申请公布日期 |
2015.06.16 |
申请号 |
US201012862187 |
申请日期 |
2010.08.24 |
申请人 |
Varian Semiconductor Equipment Associates, Inc. |
发明人 |
Rosen Gary J.;Sinclair Frank;Soskov Alexander;Buff James S. |
分类号 |
B22D46/00;B22D21/00;G01B7/06;B22D2/00;C30B11/00;B22D11/12;B22D11/14;C30B15/00;C30B29/06;C30B35/00;C30B29/64;C30B29/08;C30B29/40;C30B29/36 |
主分类号 |
B22D46/00 |
代理机构 |
|
代理人 |
|
主权项 |
1. A sheet-forming apparatus comprising:
a melt of a material; a sheet of said material disposed in said melt, wherein said sheet has a higher resistivity than said melt; a cooling plate disposed a distance above a surface of said melt that is configured to form said sheet; an eddy current measurement system for providing real-time monitoring and feedback of a thickness of said sheet as it is formed in said melt, the eddy current measurement system comprising: an exciting coil and a sensing coil disposed a second distance above said surface of said melt downstream of said cooling plate; and a power source connected to said exciting coil; and a controller connected to said eddy current measurement system, said controller programmed to execute instructions to increase a temperature of said cooling plate if said sheet is thicker than desired and to decrease a temperature of said cooling plate if said sheet is thinner than desired. |
地址 |
Gloucester MA US |