发明名称 Electronic device
摘要 An electronic device includes a motherboard, a power module, a hard disk module, a fan module, a heating module and a power-supply wind scooper. The power module is arranged on a front side of the motherboard along a longitudinal direction, and has a power-supply opening. The hard disk module is stacked on the module. The fan module is located on a rear side of the motherboard along a transverse direction, and further provides airflows towards the power-supply opening of the power module. The heating module is arranged on the motherboard, and further located between the fan module and the power module. The power-supply wind scooper shields a part of the power-supply opening, so as to respectively guide parts of the airflow into the power module and the heating module.
申请公布号 US9058158(B2) 申请公布日期 2015.06.16
申请号 US201313775267 申请日期 2013.02.25
申请人 Inventec (Pudong) Technology Corporation;INVENTEC CORPORATION 发明人 Chen Jing;Chen Chien-Lung
分类号 H05K5/00;H05K7/20;G06F1/20 主分类号 H05K5/00
代理机构 CKC & Partners Co., Ltd. 代理人 CKC & Partners Co., Ltd.
主权项 1. An electronic device, comprising: a motherboard; a power module, being arranged on a front side of the motherboard along a longitudinal direction and having a power-supply opening; a hard disk module, being arranged on the front side of the motherboard along the longitudinal direction and further stacked with the power module; a fan module, being located on a rear side of the motherboard relative to the front side along transverse direction perpendicular to the longitudinal direction and further providing airflows towards the power-supply opening of the power module; a heating module, arranged on the motherboard and further located between the fan module and the power module; and a power-supply wind scooper, being arranged to shield a part of the power-supply opening, so that a first airflow flowing through the heating module is prevented by the power-supply wind scooper from flowing into the power module, and a second airflow not flow through the heating module flows into the power module from the part of the power-supply opening not shielded by the power-supply wind scooper.
地址 Shanghai CN
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