Semiconductor device

摘要

A semiconductor device is disclosed. One embodiment includes a carrier, a semiconductor chip attached to the carrier, a first conducting line having a first thickness and being deposited over the semiconductor chip and the carrier and a second conducting line having a second thickness and being deposited over the semiconductor chip and the carrier. The first thickness is smaller than the second thickness.

主权项

1. A semiconductor device comprising:
a carrier; a semiconductor chip having side faces extending between a top surface and a bottom surface, the bottom surface attached to the carrier; a structured insulating layer disposed directly on the side faces, the top surface, and a surface of the carrier leaving contacts on the top surface of the semiconductor chip and contact pads on the carrier exposed; a first conducting line having a first thickness; a second conducting line having a second thickness; wherein the first thickness is smaller than the second thickness, and wherein the first and second conducting lines are disposed on the structured insulating layer and extend between contacts on the top surface of the semiconductor chip and contact pads on the carrier; a housing of the semiconductor device comprising a mold material encapsulating the semiconductor chip, the structured insulating layer, and the first and second conducting lines; and an insulating barrier covering the first conducting line, exposing the second conducting line and being encapsulated by the mold material of the housing.