| 摘要 |
<p>The present invention relates to an apparatus and a method for treating a substrate. The apparatus for treating a substrate includes: a chamber which has a housing for performing a substrate process and an exhaust line located at one side of the housing; a main exhaust unit which is located at the outside of the chamber and has a combination line detachable from the exhaust line; and an opening/closing unit which is arranged at the end of the combination line, opens the combination line when the combination line is combined to the exhaust line, and closes the combination line when the combination line is separated from the exhaust line.</p> |
