| 摘要 |
A material deposition system is configured to deposit material on an electronic substrate, such as a printed circuit board. The material deposition system includes a frame (20), a support (22) coupled to the frame (20) and configured to support an electronic substrate during a deposit operation, a gantry (24) coupled to the frame (20), and two deposition heads (14, 16) coupled to the gantry (24). Each deposition head includes a needle, with the deposition heads (14, 16) being movable over the support (22) by movement of the gantry (24). The material deposition system further includes a needle cleaner assembly movable on a needle cleaner gantry (24), with the needle cleaner assembly being configured to clean needles of the deposition heads (14, 16). The material deposition system further includes a controller (18) configured to control the operation of the needle cleaner assembly to perform a needle cleaning operation. |
