| 摘要 |
A processing system for electroplating semiconductor wafers and similar substrates comprises an electrolyte tank, one or more processing chamber connected to the electrolyte tank through fluid lines, and a electrolyte analyzer. The electrolyte analyzer includes a probe such as a voltage-current method probe in an electrolyte tank, a pump, a storage, and one or more valve, and the components are connected through the fluid lines for forming a fluid loop. The valve can be switched to provide an opened fluid loop for removing the used electrolyte and inducing a new electrolyte into the fluid loop from a tank, and to provide a closed fluid loop in which electrolyte circulates through the probe to analyze the electrolyte. The used electrolyte can be moved to a equipment drain part for reducing risk of contamination, and does not return to the electrolyte tank. |
